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Polycrystalline Diamond Powder

Polycrystalline diamond is synthesized by explosion method, more crystal edges and grinding surface, each crystal edge has grinding force during polishing, and coarse particles will break into smaller particles during grinding It can maintain continuous grinding force, and is not easy to cause scratches....

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Brief Introduction

Synthesized by explosive method, its particle crystal structure is very similar to that of natural Carbonado, and it is combined into a polycrystalline structure through unsaturated bonds. Compared with single crystal diamond, polycrystalline diamond has more crystal edges and grinding surfaces, and each crystal edge has cutting ability, so it has a high removal rate. Polycrystalline diamond has toughness and self-sharpness. During the polishing process, coarse particles will be broken into smaller particles, which can avoid scratches on the surface of the workpiece, which not only ensures the surface quality of the workpiece, but also improves the grinding and cutting efficiency. These high-quality products show their unique advantages during processing and have good toughness.

Specification:

Product Advantage

· Similar to Carbonado's structure and appearance, gray-black appearance, slightly metallic luster.
· High wear resistance and long service life.
· A complete range of particle sizes, including micron, submicron and nanometer particle sizes.
· The particle size distribution range is narrow, and a uniform surface roughness can be obtained.
· The product quality is stable and the difference between batches is small.
· Can achieve ultra-high purity, the main impurity content is below 100ppm.
· While maintaining a high cutting capacity, it can achieve high-precision polishing effect, not easy to produce scratches.

Product Application

· Sapphire processing: Sapphire substrates, LED chips, windows, watch lenses, mobile phone fingerprint recognition films, mobile phone camera lenses and other sapphire materials are ground or polished.

· Metal processing: grinding or polishing of super hard alloy metal materials such as stainless steel, aluminum parts, copper parts, mold steel, mobile phone logo, mobile phone middle frame, mobile phone card slot, mobile phone keys, mobile phone backplane, medical device parts, molds, etc.

· Ceramic processing: Zirconium oxide ceramic shaped parts, ceramic beads, ceramic discs, aluminum nitride substrates, ceramic ferrules, mobile phone ceramic covers, ceramic fingerprints, watch ceramic structural parts, ceramic sleeves and other ceramic materials are ground or polished.

· Semiconductor processing: silicon wafer, germanium, gallium arsenide, indium phosphide, silicon carbide, gallium nitride and other semiconductor materials are ground or polished.

· Infrared crystal processing: grinding and polishing of crystal materials such as laser crystals, magneto-optical crystals, scintillation crystals, birefringent crystals, and nonlinear optical crystals; zinc selenide, germanium, silicon, zinc sulfide, calcium fluoride, magnesium fluoride, niobium Grinding or polishing of infrared materials such as lithium acid, lithium carbonate, and sulfur-based infrared.

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Polycrystalline Diamond Powder

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